To provide an aqueous dispersion element for chemical mechanical polishing, which is suitably used for forming a circuit board with its resin substrate having a copper- or copper-alloy-containing wiring layer and which is sufficiently fast to polish copper or a copper alloy and excellent in terms of the planarization of the circuit board to be obtained.
The aqueous dispersion element for chemical mechanical polishing is used to form the circuit board whose resin substrate has the copper- or copper-alloy-containing wiring layer; it includes: (A) at least one kind of organic acid or organic acid salt; (B) at least one kind of surfactant or water-soluble high-molecular compound; (C) an oxidizer; and (D) abrasive grains, and has a relation of MA/MD =1 to 30 and a pH value of 8 to 12, where MA is a concentration (mass%) of the (A) component and MD is a concentration (mass%) of the (D) component with respect to the aqueous dispersion element for chemical mechanical polishing.
SHIDA HIROTAKA
| JP2003313542A | 2003-11-06 | |||
| JP2008124377A | 2008-05-29 | |||
| JP2005268666A | 2005-09-29 | |||
| JP2003313542A | 2003-11-06 | |||
| JP2003173517A | 2003-06-20 |
| WO2009054456A1 | 2009-04-30 |
Yukio Fuse
Mina Tsuzuki