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Title:
AQUEOUS EMULSION COMPOSITION AND ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2003342335
Kind Code:
A
Abstract:

To provide an aqueous emulsion composition which can exhibit sufficient adhesive performances to a wide range of materials such as a low-polar molded article and the like without a degreasing treatment, and an adhesive composition containing the aqueous emulsion composition.

The aqueous emulsion composition is prepared using at least a film-forming resin, a photopolymerization initiator and an ethylenically unsaturated monomer so that the photopolymerization initiator is contained in an amount of 15-160 pts.wt., based on 100 pts.wt. of the ethylenically unsaturated monomer. The aqueous emulsion composition is suitably employed as an adhesive composition such as a primer, an adhesive and the like and exhibits high adhesive strength to a wide range of materials without a degreasing treatment to satisfactorily glue various kinds of molded articles such as a plastic film, a plastic sheet, a plastic foam, a fiber, a synthetic leather, a metal and the like.


Inventors:
KURODA MASASHI
OKAYA SUSUMU
SHIRAKI HIROYUKI
Application Number:
JP2002153516A
Publication Date:
December 03, 2003
Filing Date:
May 28, 2002
Export Citation:
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Assignee:
MITSUI TAKEDA CHEMICALS INC
International Classes:
C08F2/44; C08F291/00; C08L33/06; C09J4/00; C09J4/02; C09J11/00; C09J11/06; C09J133/06; C09J201/00; (IPC1-7): C08F291/00; C08F2/44; C09J4/00; C09J4/02; C09J11/00; C09J201/00
Attorney, Agent or Firm:
Hiroyuki Okamoto