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Patent Searching and Data


Title:
AQUEOUS RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3814706
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a good-stability aqueous resin composition which can give a coating film of good properties, and, especially when used as an undercoating agent for ceramic siding boards, can form an undercoat satisfactory in adhesion, reinforcing performance, adhesion to a topcoating material, etc., and excellent in water resistance, moisture resistance, alkali resistance, resistance to injure by freezing, etc.
SOLUTION: There is provided an aqueous resin composition containing (A) a water-dispersible resin made from a monomer component comprising at least one ethylenically unsaturated monomer selected among unsaturated organic acids and salts thereof and an ethylenically unsaturated monomer copolymerizable therewith, (B) a water-soluble resin made from a monomer component comprising at least one ethylenically unsaturated monomer selected among unsaturated carboxylic acids and salts thereof and an ethylenically unsaturated monomer copolymerizable therewith, and (C) a crosslinkable resin containing carboxyl-reactive crosslinkable functional groups.


Inventors:
Ikuro Daichi
Hiroki Momohara
Application Number:
JP6254098A
Publication Date:
August 30, 2006
Filing Date:
March 13, 1998
Export Citation:
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Assignee:
Chuo Rika Kogyo Co., Ltd.
International Classes:
C04B41/63; C08L33/02; C08L35/00; C08L41/00; C08L57/06; C09D133/02; C09D157/06; (IPC1-7): C08L57/06; C04B41/63; C08L33/02; C08L35/00; C08L41/00; C09D133/02; C09D157/06
Domestic Patent References:
JP6049367A
JP7011153A
Attorney, Agent or Firm:
Eiji Saegusa
Kakehi Yuro
Takeshi Ohara
Hiroji Nakagawa
Yasumitsu Tate
Kenji Saito
Jun Fujii
Hitoshi Seki
Mutsuko Nakano
Shinsuke Otsuki
Suzuki Katsuto