Title:
AQUEOUS STRIPPING AND CLEANING COMPOSITION
Document Type and Number:
Japanese Patent JP2009102729
Kind Code:
A
Abstract:
To provide aqueous compositions used to remove post etch organic and inorganic residues as well polymeric residues and contaminants from semiconductor substrates.
The compositions are comprised of a water soluble organic solvent, a sulfonic acid or its corresponding salt and water.
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Inventors:
EGBE MATTHEW I
PETERS DARRYL W
PETERS DARRYL W
Application Number:
JP2008238167A
Publication Date:
May 14, 2009
Filing Date:
September 17, 2008
Export Citation:
Assignee:
AIR PROD & CHEM
International Classes:
C23G5/036; B08B3/08; C09D9/00; C11D1/14; C11D1/22; C11D3/34; C11D3/43; C11D7/26; C11D7/32; C11D7/34; C11D7/50; C11D7/60; C11D11/00; C23G5/02; G03F7/42; H01L21/02; H01L21/027; H01L21/304; H01L21/3213; H05K3/26
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Atsushi Ebiya
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Atsushi Ebiya