Title:
耐アーク性ＢＭＣ
Document Type and Number:
Japanese Patent JP6901257
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an arc resistance bulk molding compound (BMC) and an electric/electronic component obtained by curing the compound.SOLUTION: A bulk molding compound (BMC) is a thermosetting resin composition containing (a) unsaturated polyester, (b) a monomer having one or more polymerizable carbon-carbon double bonds, (c) aluminum hydroxide, (d) a chopped strand glass fiber, (e) a low constrictive agent and (f) a curing agent, wherein a content of (c) the aluminum hydroxide is 300-590 pts.mass with respect to 100 pts.mass of the total amount of (a) the unsaturated polyester and (b) the monomer, and a content of (d) the chopped strand glass fiber is 10-200 pts.mass with respect to 100 pts.mass of the total amount of (a) the unsaturated polyester and (b) the monomer. It is preferable that the BMC further contains 0.2-30 pts.mass of (g) a compound containing a phosphate group with respect to 100 pts.mass of the total amount of (a) the unsaturated polyester and (b) the monomer.SELECTED DRAWING: None
Inventors:
Nobuyuki Takahashi
Takahito Ishiuchi
Shotaro Itami
Ryohei Ito
Takahito Ishiuchi
Shotaro Itami
Ryohei Ito
Application Number:
JP2016234929A
Publication Date:
July 14, 2021
Filing Date:
December 02, 2016
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
C08J5/08; C08F283/01
Domestic Patent References:
| JP2003082110A | ||||
| JP2001261954A | ||||
| JP2001114998A | ||||
| JP9241496A |
Foreign References:
| WO2013089196A1 |