Title:
芳香族ポリアミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
Document Type and Number:
Japanese Patent JP4095381
Kind Code:
B2
Inventors:
Takeshi
Yamazaki
Nobuhito Aoki
Yamazaki
Nobuhito Aoki
Application Number:
JP2002257935A
Publication Date:
June 04, 2008
Filing Date:
September 03, 2002
Export Citation:
Assignee:
Gunei Chemical Industry Co., Ltd.
International Classes:
C08G69/32; C08G59/50; C08G59/62; C08K3/00; C08L63/00; C08L77/10; C09D163/00; C09D177/10; C09J163/00; C09J177/10
Domestic Patent References:
| JP2001329061A | ||||
| JP3200836A | ||||
| JP2138338A | ||||
| JP2002020485A | ||||
| JP3037228A | ||||
| JP5148367A | ||||
| JP4023864A | ||||
| JP5078476A | ||||
| JP9176485A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama