Title:
AROMATIC POLYIMIDE MULTILAYER FILM
Document Type and Number:
Japanese Patent JP3019806
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an integrally bonded aromatic polyimide film having an unevenness due to the presence of inorganic particles on its surface and a polyimide surface layer including no crack.
SOLUTION: In the aromatic polyimide multilayer film comprising a self-supporting aromatic polyamic acid solution layer containing a solvent and inorganic particles and directly laminated on an aromatic polyamic acid solution layer containing the solvent in such a manner that no solvent crazing occurs on the surface of the layer side containing the particles obtained by deriving the self-supporting aromatic polyamic acid solution film by heating, it is stretched before deriving it by heating.
Inventors:
Hiroshi Inoue
Tetsuji Hirano
Tetsuji Hirano
Application Number:
JP16653297A
Publication Date:
March 13, 2000
Filing Date:
June 09, 1997
Export Citation:
Assignee:
Ube Industries,Ltd.
International Classes:
B32B27/34; C08K3/00; C08L79/08; H05K1/03; (IPC1-7): B32B27/34; C08K3/00; C08L79/08
Domestic Patent References:
| JP6266932A | ||||
| JP56118857A | ||||
| JP6164730A | ||||
| JP51103147A |
Attorney, Agent or Firm:
Yasuo Yanagawa