To provide a sheet for reinforcing a flexible circuit board having excellent heat resistance, formability and punchability by improving characteristics of a polyether-aromatic resin.

The resin composition comprises 100 pts. wt. resin comprising two or more kinds of the polyether-aromatic ketone resin, and thermoplastic resins having ≥100°C glass transition temperature, and 5-50 pts. wt. tabular filler having 1-10 μm average particle diameter. The film and the sheet are also provided.