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Title:
ARRANGEMENT OF BAR SHAPED MAGNETRON OR SPUTTERING CATHODE, SPUTTERING METHOD, DEVICE FOR CONDUCTING THIS METHOD AND TUBULAR TARGET
Document Type and Number:
Japanese Patent JPH01104770
Kind Code:
A
Abstract:

PURPOSE: To enable a high performance sputtering process for a material not suitable to produce an integrated target, etc., by arranging at least one of heat contact layers between a target, which consists of a single or several rings mounted to a carrier tube for particularly changable, and a carrier tube.

CONSTITUTION: A heat contact layer 38 made of metal, which is arranged between a carrier tube 36 and rings 37, 37', 37' consisting of a target material, enables heat transfer from the target material heated with gas discharge to the carrier tube 36, further from thereon, an optimum heat transfer to a cooling material leaking out between the carrier tube 36 and a permanent magnet 6 system. By this method, the target material is sufficiently cooled and is not melted at a corresponding high output intensity. Thus, a relatively thick target material can be used and a durability time of this arrangement is extended.


Inventors:
GERUTONAA BUARUTAA
KOROSHIETSUTSU FURANTSU
BUAGENDORISHIYUTERU ARUFURETSU
BANGERUTO HERUBUITSUHI
Application Number:
JP18444288A
Publication Date:
April 21, 1989
Filing Date:
July 22, 1988
Export Citation:
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Assignee:
MIBA GLEITLAGER AG
International Classes:
C23C14/16; C23C14/34; F16C33/12; H01J23/00; H01J37/34; (IPC1-7): C23C14/34; H01J23/00; H01J37/34
Domestic Patent References:
JPS59197570A1984-11-09
JPS5266837A1977-06-02
JPS5923870A1984-02-07
JP58087867B
JPS5597472A1980-07-24
JPS5920470A1984-02-02
JPS59116375A1984-07-05
JPS6176673A1986-04-19
Attorney, Agent or Firm:
Takashima Ichi



 
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