Title:
ARRANGEMENT MEMBER FOR FORMING NON-BONDED REGION AND WATERPROOF SHEET BONDING METHOD
Document Type and Number:
Japanese Patent JP2022048043
Kind Code:
A
Abstract:
To provide an arrangement member for forming a non-bonded region selectively arranged between a waterproof sheet and a floor surface side corresponding to the non-bonded region to be formed so that the bonded region where the waterproof sheet is bonded to the floor surface side and the non-bonded region where the waterproof sheet is not bonded to the floor surface side are formed at an edge part of the waterproof sheet when the waterproof sheet is laid by being bonded to the floor surface side as a skeleton using a liquid material containing a solvent or an adhesive, and to provide a method for bonding the waterproof sheet using the arrangement member for forming the non-bonded region.SOLUTION: An arrangement member 201 for forming a non-bonded region is used for laying a waterproof sheet 8B (first waterproof sheet), and the waterproof sheet 8B is bonded to its edge by being supplied with a liquid material; at the edge part, a bonded region and the non-bonded region are provided, and they are used for forming the non-bonded region, and is used by being selectively arranged to the non-bonded region when continuously supplying the liquid material to the edge part of the waterproof sheet 8B.SELECTED DRAWING: Figure 15
Inventors:
IKEDA HIROKAZU
Application Number:
JP2020154177A
Publication Date:
March 25, 2022
Filing Date:
September 14, 2020
Export Citation:
Assignee:
S B SHEET WATERPROOF SYS CO LTD
International Classes:
E04D5/14
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi