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Patent Searching and Data


Title:
ARRANGEMENT AND METHOD FOR TREATING RESIN
Document Type and Number:
Japanese Patent JP2002114865
Kind Code:
A
Abstract:

To provide an arrangement for resin treatment having such a construction that a grinder for a resin object and a volume reducer for dissolving a ground resin object to reduce its volume are set up separately and connected to each other closed loop-fashion to carry out an efficient resin treatment while ensuring the odor of the solvent used in the reducer not to leak outside, and to provide a method for resin treatment using the arrangement.

This arrangement 10 for resin treatment is designed to grind and dissolve a resin object and comprises a grinder 12 for grinding an object, a volume reducer 14 for dissolving an object ground by the grinder 12 in a solvent 32 to reduce its volume, a conveyance channel 18 for feeding a ground object discharged from the grinder 12 into the volume reducer 14, and a communicating path 20 connecting the inside of the volume reducer 14 and that of the grinder 12 with each other; wherein the grinder 12 and the volume reducer 14 are connected with each other closed loop-fashion.


Inventors:
MATSUSHIMA MINORU
HIRAFUNE YASUHIRO
Application Number:
JP2000307935A
Publication Date:
April 16, 2002
Filing Date:
October 06, 2000
Export Citation:
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Assignee:
SONY CORP
International Classes:
B02C18/00; C08J11/08; (IPC1-7): C08J11/08; B02C18/44
Attorney, Agent or Firm:
Oka-saki-Shintaro (1 person outside)