Title:
少なくとも１つのパワー半導体モジュールと輸送包装を備えて構成される配列装置
Document Type and Number:
Japanese Patent JP5732261
Kind Code:
B2
Abstract:
The arrangement (1) comprises a transportation packaging (2) provided with a planar sheet (10), a covering film (30), and a drip-tray type plastic structure (80). The plastic structure partly encloses the power semiconductor module (5). The side of power semiconductor module directly or indirectly rests on the major surface of the planar sheet. The farthest sides of power semiconductor module are covered by the covering film.
Inventors:
Stephan Starovetsky
Application Number:
JP2011005746A
Publication Date:
June 10, 2015
Filing Date:
January 14, 2011
Export Citation:
Assignee:
SEMIKRON Elektronik GmbH & Co.KG
International Classes:
B65D85/86; B65D73/00; B65D75/36
Domestic Patent References:
| JP50088383U | ||||
| JP1009175A | ||||
| JP9077131A | ||||
| JP3256856A | ||||
| JP2006051630A | ||||
| JP6270955A | ||||
| JP5010283U |
Foreign References:
| GB1580791A |
Attorney, Agent or Firm:
Fujita Akira
Hideki Imai
Kanazawa Mitsuhiro
Hideki Imai
Kanazawa Mitsuhiro