Title:
アレイ基板及びその製造方法、並びに表示装置
Document Type and Number:
Japanese Patent JP7323521
Kind Code:
B2
Abstract:
An array substrate, a method of manufacturing the array substrate, and a display apparatus are disclosed. The array substrate includes: a base substrate; a plurality of sensing elements disposed on a first side of the base substrate and each configured to convert at least one of a light signal and an acoustic wave signal into an electrical signal; and a plurality of switching devices disposed on a second side of the base substrate opposite to the first side. The plurality of switching devices include a plurality of first switching elements, and each of the plurality of first switching elements is electrically connected to a corresponding one of the plurality of sensing elements to transmit the electrical signal.
Inventors:
李 ▲海▼旭
曹 占▲鋒▼
Founding of Wang
曹 占▲鋒▼
Founding of Wang
Application Number:
JP2020526494A
Publication Date:
August 08, 2023
Filing Date:
May 08, 2019
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO.,LTD.
International Classes:
A61B5/1172; G02F1/1368; G09F9/00; G09F9/30
Domestic Patent References:
| JP2018085114A | ||||
| JP2018005910A | ||||
| JP2008293136A | ||||
| JP2003207306A |
Foreign References:
| EP3168774A1 | ||||
| CN106129069A | ||||
| WO2010047227A1 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mihiro
Shinya Mihiro
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