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Title:
ARTICLE COMPRISING MATERIAL CONTAINING SILICON
Document Type and Number:
Japanese Patent JP2003239087
Kind Code:
A
Abstract:

To provide an article which is provided with a layer containing a coefficient of thermal expansion compatible with a material, and also containing a coefficient of thermal expansion compatible with the other optional adjacent layer.

The article comprises a material containing silicon and at least one layer. The layer contains a coefficient of thermal expansion (CTE) tailoring additive in an amount sufficient to maintain a compatible CTE with at least one adjacent layer and the material.


Inventors:
SUN ELLEN Y
EATON HARRY E
Application Number:
JP2002000367435
Publication Date:
August 27, 2003
Filing Date:
December 19, 2002
Export Citation:
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Assignee:
UNITED TECHNOLOGIES CORP
International Classes:
B32B15/01; B32B18/00; C04B41/50; C04B41/87; C04B41/89; C23C4/10; C23C28/00; C23C30/00; F01D5/28; (IPC1-7): C23C30/00; B32B15/01; C04B41/87
Attorney, Agent or Firm:
鈴木 正剛



 
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