Title:
銅スラグからのAs溶出防止方法
Document Type and Number:
Japanese Patent JP4879207
Kind Code:
B2
Abstract:
A process of water-granulating copper smelting slag can readily suppress elution of As from the copper smelting slag. A process of water-granulating a copper smelting slag with granulation water in a circulating system, includes granulating the copper smelting slag with the granulation water; settling suspended solids from the granulation water circulating in the system in a settling tank followed by discharging part of the granulation water through the settling tank from the system; and feeding supplementary water having a concentration of As of 0.01 mg/L or less into the system in such an amount that the total amount of the granulation water circulating in the system is kept constant; wherein the amount of granulation water discharged through the settling tank is such that As eluted from the copper smelting slag after water granulation is 0.01 mg/L or less.
Inventors:
Tetsuo Yamaki
Katsuya Toda
Katsuya Toda
Application Number:
JP2008057917A
Publication Date:
February 22, 2012
Filing Date:
March 07, 2008
Export Citation:
Assignee:
Pan Pacific Copper Co., Ltd.
International Classes:
C04B5/02; B09B3/00; C04B5/06; F27D15/02
Domestic Patent References:
| JP2005289697A | ||||
| JP2006327909A | ||||
| JP2005139027A | ||||
| JP8301636A |
Attorney, Agent or Firm:
Axis International Patent Business Corporation