Title:
拡張可能型組み立てラックの組み立て素子アセンブリ
Document Type and Number:
Japanese Patent JP4486137
Kind Code:
B2
Abstract:
An interlocking component assembly of an expandable rack assembly is proposed, including a plurality of horizontally-deposed panels each formed with a first opening, a plurality of vertically-deposed panels each disposed between two horizontally-deposed panels, a plurality of middle joint components each disposed in vertically-deposed panels, and a plurality of interlocking components each adapted for interconnecting two middle joint components to interconnect and fasten the horizontally-deposed panel to the vertically-deposed panel, wherein the height of the vertically-deposed panel is greater than the length of the middle joint component, such that the vertically-deposed panel can be coupled to the interlocking component to securely engage the horizontally-deposed panel with the vertically-deposed panel, thereby enabling the rack assembly to be free from limitations of assembling locations or dimensional specifications while the structural rigidity and strength of the assembled rack unit is enhanced.
Inventors:
Cai Eiji
Application Number:
JP2008048340A
Publication Date:
June 23, 2010
Filing Date:
February 28, 2008
Export Citation:
Assignee:
Cai Eiji
International Classes:
A47B47/02
Domestic Patent References:
| JP294812Y1 | ||||
| JP5015558Y1 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro