To provide an assembling inspection method using lead-free solder which compensates for the deterioration of assembling/inspecting ability due to material characteristic and an electronic circuit board and electronic appliance manufactured by using the assembling inspection method.
As shown in (a), when lead-free solder is used in the air, the solder does not spread owing to poor wettability and surface tension. In an inactive environment, however, the generation of oxidized film is extremely suppressed because of the decrease in oxygen. In addition, the effect of compensating for the deterioration of the wettability of the material is obtained because the oxidation does not proceed. As a result, as shown in (b), even when the solder containing no lead is used, the same result with the conventional soldering which contains lead excellent in wettability can be obtained. Therefore, the inspection device and the positioning precision of probe pin as in the conventional practice can be obtained and the inspection free from defective conductivity can be performed. Therein, 20 is an electronic parts, 21 is a land for checker, 22 is a copper foil part, 23 and 23' are lead free solder.
| JPH10293157 | SPLICER FOR INSPECTING ELECTRONIC PARTS |
MUKAI KATSUHIKO
NAKAGAWA HIROMITSU
| JPH03297190A | 1991-12-27 | |||
| JP2000151095A | 2000-05-30 | |||
| JPH10256722A | 1998-09-25 | |||
| JPH0994691A | 1997-04-08 | |||
| JPH05264588A | 1993-10-12 |