Title:
ASSEMBLING METHOD OF CAP SEALED TYPE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5314566
Kind Code:
A
Abstract:
PURPOSE: To extremely simplify construction and perform positioning simply by placing connecting stems on an alignment base provided with lead wire supporting grooves by connecting the stems mutually with two connecting plates via supporting plates.
Inventors:
MITSUI KAZUHIRO
HONDA TOSHIHIKO
ICHIKI MASAHIRO
TACHIBANA OSAMU
HONDA TOSHIHIKO
ICHIKI MASAHIRO
TACHIBANA OSAMU
Application Number:
JP8815876A
Publication Date:
February 09, 1978
Filing Date:
July 26, 1976
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/04; H01L23/02; (IPC1-7): H01L23/02