To assemble lead terminals arranged on a board to a terminal arranging board for ensuring the positional accuracy to their array position spacings, without being influenced by the number of terminals or the bending strength.

Lead terminals 31 arranged on ceramic boards 10 are previously expanded wider than specified array position spacings to both sides. For inserting into a terminal arranging board 35, the lead terminals 31 are narrowed more than the pressed array position spacings and faced at holes 35a of the terminal arranging board 35 formed so that the gap between the outside of each lead terminal 31 and the hole 35a is greater than at least a specified size. Thus it is possible to assemble the lead terminals 31 arranged on the ceramic boards 10 to the terminal arranging board 35 for ensuring the positional accuracy to their array position spacings, without being influenced by the terminal number or the bending strength, thereby compensating the array position spacings between the lead terminals 31 disposed on the ceramic boards 10 and holes of an objective board through the terminal arranging board 35.