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Title:
ASSEMBLING METHOD FOR ETCHING THIN PLATE FOR FORMING FLUID MODULE
Document Type and Number:
Japanese Patent JP2000249112
Kind Code:
A
Abstract:

To form an etching thin plate layer and facilitate an integral assembling of a module having fluid-element, electrical, and mechanical components by executing a material removal treatment to each thin plate member and mutually attaching a set of thin plate members in such a state as forming a modular subsystem.

A set of components including a set of multi-separating valves 14a, 14b connected to a plurality of parallel-connecting flow control valves 161-16N are provided between an inlet filter 12 and an outlet filer 13 of a fluid module 10. The respective flow control valves 161-16N are connected in series with respective corresponding flow registers 181-18N. A lot of layers constituting the flow control module 10 by sandwiched between a top external member and a bottom external member etches a thin plate of a starting material protected by a photosensitive anti-corrosion film by using photochemical pulverizing treatment. These lots of layers can be mutually attached using a sealing layer between a lot of layers and a fastening tool by mechanical binding using diffusion bonding, electronic beam welding, and adhesive.


Inventors:
OTSAP BEN A
CARDIN JOSEPH M
GONZALEZ ANTONIO E
DYER KEITH
Application Number:
JP2000046465A
Publication Date:
September 12, 2000
Filing Date:
February 23, 2000
Export Citation:
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Assignee:
VACCO
International Classes:
F15C3/00; F03H99/00; F15C5/00; (IPC1-7): F15C3/00; F15C5/00
Domestic Patent References:
JPH07508085A1995-09-07
Foreign References:
WO1997047013A11997-12-11
Attorney, Agent or Firm:
Ryuka Akihiro