Title:
ASSEMBLING METHOD FOR MICRO-MECHANIC SENSOR
Document Type and Number:
Japanese Patent JPH0575176
Kind Code:
A
Abstract:
PURPOSE: To reduce stresses due to the assembling of the micromechanical sensor. CONSTITUTION: In an assembling method for a micromechanical sensor, especially, a hole sensor or a pressure or acceleration sensor and at least silicon sensor element is fitted to a carrier, at least one silicon sensor element 10 is coupled with a carrier 20 through at least one of assembly pedestals 11 and 12, whose mount surface is smaller than the surface of the silicon sensor element 10. A gap 50 is formed between the carrier 20 and silicon sensor element 10 outside the ranges of at least one of the assembly pedestals 11 and 12.
Inventors:
RORUFU BETSUKAA
KURAUSU IETSUKERU
IIRI MAREKU
FURANKU BANTEIEN
HERUMUUTO BAUMAN
KURUTO BUAIPUREN
MARUTEIN BUIRUMAN
KURAUSU IETSUKERU
IIRI MAREKU
FURANKU BANTEIEN
HERUMUUTO BAUMAN
KURUTO BUAIPUREN
MARUTEIN BUIRUMAN
Application Number:
JP5035792A
Publication Date:
March 26, 1993
Filing Date:
March 09, 1992
Export Citation:
Assignee:
BOSCH GMBH ROBERT
International Classes:
G01R33/07; B81B7/00; G01L9/00; G01P15/08; H01L29/84; H01L43/04; (IPC1-7): G01R33/06; H01L29/84; H01L43/04
Attorney, Agent or Firm:
Toshio Yano (2 outside)