ASSEMBLING METHOD OF SEMICONDUCTOR DEVICE

Title:

ASSEMBLING METHOD OF SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JPS5363870

Kind Code:

A

Abstract:

PURPOSE:To prevent shortcircuiting owing to the deflection of wires by moving dropped-insulation paste around tab through air blowing and covering only the circumfernce thereof thickly.

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Inventors:

INABA TOORU

Application Number:

JP13831676A

Publication Date:

June 07, 1978

Filing Date:

November 19, 1976

Export Citation:

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Assignee:

HITACHI LTD

International Classes:

H01L21/52; H01L21/58; H01L21/60; (IPC1-7): H01L21/58; H01L21/60

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