Title:
ASSEMBLING METHOD FOR SOLID-STATE IMAGE PICKUP DEVICE
Document Type and Number:
Japanese Patent JPH03197911
Kind Code:
A
Abstract:
PURPOSE:To adjust the relative fitting position of an optical lens and a solid- state image pickup element and to obtain the solid-state image pickup element with high accuracy by engaging positioning pins provided on the 1st surface of an assembly member with positioning holes formed in the rear surface of an optical lens holding member which is fitted with the optical lens on the front surface. CONSTITUTION:The positioning pins 43a and 43b, and 44a and 44b are projected on the front surface and rear surface sides of the assembly member 35 corresponding to the front and rear surface sides. The engagement holes 58 and 59 that the projected positioning pins 43b and 44b engage are bored on the rear surface side of the assembly member 35. Then the assembly member 35 is supported by engaging the positioning pins 43a and 43b with the engagement holes 58 and 59, then positioned on the mount surfaces of a couple of fixed support blocks 52 and 53. Consequently, the relative fitting positions of the optical lens and solid-state image pickup element are accurately and easily adjusted, and the optical lens and solid-state image pickup element can be positioned with extremely high accuracy.
Inventors:
OGAWA YOSHIHISA
Application Number:
JP25152190A
Publication Date:
August 29, 1991
Filing Date:
September 20, 1990
Export Citation:
Assignee:
SONY CORP
International Classes:
G02B7/00; H01L27/14; H01L31/0232; H04N5/225; H04N5/335; H04N5/372; (IPC1-7): G02B7/00; H01L27/14; H01L31/0232; H04N5/225; H04N5/335
Attorney, Agent or Firm:
Akira Koike (1 person outside)