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Patent Searching and Data


Title:
ASSEMBLY HOUSING CASE
Document Type and Number:
Japanese Patent JPH10135665
Kind Code:
A
Abstract:

To provide an assembly housing case for mounting a module rail adaped to the assembly housing case by a simple method which has a face having resistance and is shielded for using in a field of electromagnetic interference of high frequency.

This case has two side face walls parallel to each other for a wiring plate which can be inserted on a guide rail, and at least four module rails 4 for fixing the guide rail. These module raise 4 are composed of aluminum processed as almite or an aluminum alloy processed as almite, and at least one abutting face 12 for one or a plurality of front face plates is provided in the front side. For ohmic contact, in a specific region of the module rail 4, an almite layer is desirably removed by a mechanical removal process from a projection 18 which is initially on the abutting face 12.


Inventors:
GUENTHER HANS-ULRICH
MAZURA PAUL
HAAG VOLKER
PFEIFER KLAUS
THALAU KLAUS-MICHAEL
JOIST MICHAEL
WEIS UDO
Application Number:
JP29449197A
Publication Date:
May 22, 1998
Filing Date:
October 27, 1997
Export Citation:
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Assignee:
SCHROFF GMBH
International Classes:
H01R4/64; H05K7/14; H05K5/04; H05K9/00; H01R4/48; (IPC1-7): H05K7/14
Attorney, Agent or Firm:
Tadashi Wakabayashi (4 others)