Title:
半田ボールを基板上に配置するためのアセンブリおよび方法
Document Type and Number:
Japanese Patent JP7121414
Kind Code:
B2
Abstract:
Assembly for placing solder from solder balls on a substrate, comprising a reservoir with a plurality of solder balls, an exit opening for releasing one single solder ball, a feeding channel between the reservoir and the exit opening with a feeding channel width larger than the diameter of one solder ball and smaller than the diameter of two solder balls, and a suction channel with end opening into the feeding channel which end is smaller than the diameter of one solder ball. A pressure difference is generated between the feeding channel and the suction channel and is controlled whereby pressure in the suction channel is smaller than in the feeding channel. A solder ball present in the feeding channel can be sucked to and held to the end of the suction channel at a first pressure difference to block feeding of solder balls and is released at a second pressure difference.
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Inventors:
AZDASHT, GHASSEM
Application Number:
JP2020514328A
Publication Date:
August 18, 2022
Filing Date:
May 15, 2018
Export Citation:
Assignee:
AZDASHT, GHASSEM
International Classes:
H01L21/60; H05K3/34
Domestic Patent References:
| JP2008100830A | ||||
| JP2011115819A | ||||
| JP2010162574A | ||||
| JP2005081406A |
Attorney, Agent or Firm:
Kichi Toshio Kawa