Title:
ASSEMBLY AND METHOD FOR SCATTERING AND WELDING SPUTTERING TARGET MATERIAL
Document Type and Number:
Japanese Patent JP2023093308
Kind Code:
A
Abstract:
To provide an assembly and method for scattering and welding a sputtering target material, capable of reducing a process, procedure, processing and manufacturing cost when processing and manufacturing a sputtering target material.SOLUTION: A scattering and welding assembly includes a target material assembly and a cover plate. The target material assembly includes a target material 11 and a back plate 12; at least one of the upper and lower surfaces of the back plate has a recessed groove; the target material is on the same plane as the back plate after being embedded in the recessed groove; and the target material is sealed in a sealed storage cavity formed by the back plate and the cover plate by covering a cover plate on the surface of the recessed groove of the back plate, sealing a contact surface or a peripheral part between the back plate and the cover plate and integrating the target material assembly with the cover plate.SELECTED DRAWING: Figure 4
Inventors:
YAMADA HIROSHI
HAYASHI TOMOYUKI
GAO CHAO
OIWA KAZUHIKO
YAO KEKE
HAYASHI TOMOYUKI
GAO CHAO
OIWA KAZUHIKO
YAO KEKE
Application Number:
JP2022131384A
Publication Date:
July 04, 2023
Filing Date:
August 19, 2022
Export Citation:
Assignee:
ZHEJIANG SAXUM SEMICONDUCTOR TECH CO LTD
International Classes:
C23C14/34; B23K15/00; B23K20/00; B23K20/12
Attorney, Agent or Firm:
Koji Tsubouchi