ASSEMBLY OF RESIN MOLDING AND COLUMN, AND MANUFACTURING METHOD AND APPARATUS FOR THE SAME

Title:

ASSEMBLY OF RESIN MOLDING AND COLUMN, AND MANUFACTURING METHOD AND APPARATUS FOR THE SAME

Document Type and Number:

Japanese Patent JP2008030352

Kind Code:

A

Abstract:

To provide an assembly which can cope with requirements for reduction of the thickness of resin molded plates, realize firm joining, improve assembling precision, e.g. the degree of verticality, allow relatively free selection of the shape of assembly members and assembling in a short time at low costs and serve as a fixing method for precision parts.

A through or bottomed attachment hole for insertion and assembling of a column is formed in the resin molding. A peripheral channel of a specified depth is formed at the assembling position of the outer peripheral surface of the column to be inserted into the attachment hole. The column is inserted into the attachment hole of the resin molding ande set at the assembling position where the inner peripheral surface of the attachment hole and the peripheral channel face each other. A compression force is applied to the periphery of the attachment hole of the resin molding in the radial direction, and ultrasonic vibration is applied to the periphery of the attachment hole from the compressed surface so that the material of the periphery of the attachment hole molten by the heat of the ultrasonic vibration is forced to flow into the peripheral channel of the column under the compression force, and the column is fixed in the attachment hole of the resin molding.

Inventors:

WATANABE YASUYUKI
KAWASAKI HISANORI
WATANABE HIDEMITSU

Application Number:

JP2006207704A

Publication Date:

February 14, 2008

Filing Date:

July 31, 2006

Export Citation:

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