Title:
材料を処理するための大気圧プラズマ処理方法
Document Type and Number:
Japanese Patent JP2010519701
Kind Code:
A
Abstract:
A plasma treatment method for processing a material includes a step of subjecting the material to a substantially atmospheric-pressure plasma, thereby obviating the need of providing expensive vacuum apparatus and pumping assemblies, while facilitating a continuous and quick treatment even in a controlled working environment. Depending on the materials to be processed, several processing methods can be used.
Inventors:
Claudia Ricardi
Paola Esana
Ruggello Alfred Barni
Ricardo Sirilandi
Stefano Tannini
Paola Esana
Ruggello Alfred Barni
Ricardo Sirilandi
Stefano Tannini
Application Number:
JP2009550779A
Publication Date:
June 03, 2010
Filing Date:
February 21, 2008
Export Citation:
Assignee:
Universita Degli Studio Di Milan-Bicocca
International Classes:
H05H1/24; B01J19/08; C08J7/00; D06M10/02; D21H25/04
Domestic Patent References:
| JP2003522827A | 2003-07-29 |
Foreign References:
| US6406759B1 | 2002-06-18 | |||
| WO2004068916A1 | 2004-08-12 | |||
| US20010020582A1 | 2001-09-13 | |||
| US20060240648A1 | 2006-10-26 | |||
| EP1582270A1 | 2005-10-05 | |||
| WO2004040630A1 | 2004-05-13 |
Attorney, Agent or Firm:
Kenji Sugimura
Kiyoshi Kuruma
Yuta Terashima
Kiyoshi Kuruma
Yuta Terashima