Title:
Au-Sb TYPE SOLDER ALLOY
Document Type and Number:
Japanese Patent JP2015139777
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a high-temperature solder alloy which has a solid phase line temperature of about 400°C or less suitable for being used for assembly of electronic parts, is excellent in wetting property, is excellent also in workability, stress relaxation, and reliability, and is made of an Au-Sb type alloy which does not contain Pb and is extremely inexpensive as compared to the conventional ordinary Au-type solder.SOLUTION: A Pb-free Au-Sb type solder alloy includes an Sb content of 21.0 to 40.0 mass% and the remainder being Au and inevitable impurity. Further, the Au-Sb type solder alloy contains at least one kind of Ag, Al, Cu, Ge, In, Mg, Ni, Sn, Zn, and P and the remainder may be Au and inevitable impurity.
Inventors:
IZEKI TAKASHI
KOMURO MASAHIKO
BONG SHUNKAI
KOMURO MASAHIKO
BONG SHUNKAI
Application Number:
JP2014012046A
Publication Date:
August 03, 2015
Filing Date:
January 27, 2014
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
B23K35/30; C22C5/02; H01L21/52
Attorney, Agent or Firm:
Masao Yamamoto
Noriyuki Tsujikawa
Noriyuki Tsujikawa
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