Title:
Au-Sn ALLOY SOLDER PASTE FOR PIN TRANSFER
Document Type and Number:
Japanese Patent JP2009226472
Kind Code:
A
Abstract:
To provide an Au-Sn alloy solder paste for pin transfer, a solder paste causing less variance in pin transfer quantity.
The Au-Sn alloy solder paste for pin transfer is composed of 10 to 25 mass% RA flux and of the remainder consisting of Au-sn alloy solder powder that has constitution containing 15-25 mass% Sn and the balance comprising Au and inevitable impurities. The paste is characterized in that the Au-Sn alloy solder powder contained in the paste has a particle distribution with the average particle size 5 m and the maximum particle size 10 m and that the viscosity of the paste is in the range of 10 to 50 Pa s.
Inventors:
Ishikawa, Masayuki
Matsuoka, Mitsuru
Matsuoka, Mitsuru
Application Number:
JP2008000077944
Publication Date:
October 08, 2009
Filing Date:
March 25, 2008
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B23K35/22; B23K3/06; B23K35/30; H05K3/34; B23K101/42