Title:
Au-Sn-BASED SOLDER ALLOY ESSENTIALLY COMPOSED OF AuSn2 INTERMETALLIC COMPOUND AND ELECTRONIC COMPONENT USING THE SOLDER ALLOY
Document Type and Number:
Japanese Patent JP2016215212
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an inexpensive Au-Sn-based solder alloy for high temperature use having workability and stress relaxation property substantially being equivalent to a conventional Au-based solder alloy.SOLUTION: A first Au-Sn-based solder alloy contains 50.0 mass% or more and 65.0 mass% or less of Sn and the balance is Au except inevitably contained elements in production. A second Au-Sn-based solder alloy contains 50.0 mass% or more and 65.0 mass% or less of Sn and 0.01 mass% or more and 3.0 mass% or less of Ge and the balance is Au except inevitably contained elements in production. The first and second Au-Sn-based solder alloys may further contain one or more kinds selected from the group consisting of Ag, Al, Cu, In, Mg, Ni, Sb, Zn and P.SELECTED DRAWING: None
Inventors:
IZEKI TAKASHI
Application Number:
JP2015100015A
Publication Date:
December 22, 2016
Filing Date:
May 15, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
B23K35/26; C22C13/00; H01L21/52; H01L23/02; H05K3/34
Attorney, Agent or Firm:
Noriyuki Tsujikawa
Masao Yamamoto
Masao Yamamoto
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