Title:
Au合金ボンディング・ワイヤ
Document Type and Number:
Japanese Patent JP3969671
Kind Code:
B2
Abstract:
Provided is a thin Au alloy bonding wire having desired strength, good bondability and stability over time, and improved circularity of a squashed ball and sphericity of a melted ball. The Au alloy bonding wire contains, in an Au alloy matrix containing 0.05 to 2 mass % in total of at least one selected from Pd and Pt of high purity in Au of high purity, as trace elements, 10 to 100 ppm by mass of Mg, 5 to 100 ppm by mass of Ce, and 5 to 100 ppm by mass of each of at least one selected from Be, Y, Gd, La, Eu and Si, the total content of Be, Y, Gd, La, Eu and Si being 5 to 100 ppm by mass, or as trace elements, Mg, Be, and at least one selected from Y, La, Eu and Si, or as trace elements, 10 to 100 ppm by mass of Mg, 5 to 30 ppm by mass of Si, 5 to 30 ppm by mass of Be, and 5 to 30 ppm by mass of at least one selected from Ca, Ce and Sn.
Inventors:
Hiroshi Murai
Atsushi Chiba
Satoshi Teshima
Atsushi Chiba
Satoshi Teshima
Application Number:
JP2006537768A
Publication Date:
September 05, 2007
Filing Date:
September 28, 2005
Export Citation:
Assignee:
Tanaka Electronics Co., Ltd.
International Classes:
H01L21/60; C22C5/02
Domestic Patent References:
| JP9321075A | ||||
| JP10294328A | ||||
| JP10098062A | ||||
| JP11087396A |
Attorney, Agent or Firm:
Kanji Arai
Naotaka Kono
Eiichiro Shimazaki
Naotaka Kono
Eiichiro Shimazaki
Previous Patent: 蓄電装置検査方法
Next Patent: WROUGHT ALUMINUM ALLOY WITH EXCELLENT HOT FORGEABILITY AND MACHINABILITY
Next Patent: WROUGHT ALUMINUM ALLOY WITH EXCELLENT HOT FORGEABILITY AND MACHINABILITY