Title:
AUDIO COMPONENT MOUNTING SYSTEM
Document Type and Number:
Japanese Patent JP2007261571
Kind Code:
A
Abstract:
To provide a system assisting to reduce force applied to an occupant in collision of an automobile by a complicated, large and heavy audio system.
The mounting system for an automobile part is disclosed. The system comprises a chassis and at least one vibration attenuation element. The vibration attenuation element is mounted into the chassis in the state that an audio component is supported and fixed. The vibration attenuation element has a slot and the slot stores a fastening part connected to the audio component. The fastening part fixes the audio component to a first position and moves in parallel along the slot by a predetermined load.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
BOGGESS BRIAN
SEMAN MATTHEW
SEMAN MATTHEW
Application Number:
JP2007076608A
Publication Date:
October 11, 2007
Filing Date:
March 23, 2007
Export Citation:
Assignee:
HONDA MOTOR CO LTD
International Classes:
B60R11/02; B60R21/045; G11B33/08; G11B33/12
Domestic Patent References:
| JPH08183413A | 1996-07-16 | |||
| JPH0948292A | 1997-02-18 | |||
| JPH074192U | 1995-01-20 | |||
| JPH08183413A | 1996-07-16 | |||
| JPH0948292A | 1997-02-18 | |||
| JP2004130825A | 2004-04-30 | |||
| JP2002050880A | 2002-02-15 | |||
| JP2003127792A | 2003-05-08 |
Foreign References:
| US4506188A | 1985-03-19 |
Attorney, Agent or Firm:
Yoichiro Shimoda
Tamiya Hiroshi
Tamiya Hiroshi