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Patent Searching and Data


Title:
AUTOMATIC BONDING APPARATUS
Document Type and Number:
Japanese Patent JPS5976436
Kind Code:
A
Abstract:
PURPOSE:To quickly detect pad with high accuracy and execute accurate line junction by providing an auxiliary lamp which flickers with the specified synchronization and allows free setting in amount of light within the specified range, in addition to the lamp for lighting. CONSTITUTION:A pulse voltage of the specified period is generated by an oscillation circuit 17 and a frequency dividing circuit 18, a transistor 20 is driven by such pulse in order to flicker a lamp 16, and an amount of light is changed with a resistor 19. With use of an auxiliary lamp 16, the junction pad 4 at the chip surface can always be quickly detected with high accuracy by taking it with a TV camera 13 on the monitor TV 14 even in case there are considerable fluctuation on the inclination of semiconductor chip 3 or surface condition of junction pad 4. Moreover, the capillary 11 is accurately controlled and thereby erroneous junction can be prevented and yield can also be improved.

Inventors:
OBATA KEIZOU
Application Number:
JP18784782A
Publication Date:
May 01, 1984
Filing Date:
October 26, 1982
Export Citation:
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Assignee:
TOSHIBA KK
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Takehiko Suzue