Title:
AUTOMATIC DICING SYSTEM BASED ON CURF CHECK
Document Type and Number:
Japanese Patent JP2628256
Kind Code:
B2
Abstract:
PURPOSE: To improve the work efficiency by constituting the precut before regular cutting so that it can automatically check the chipping condition of a curf by means of an image processing means, in an object cutting a semiconductor wafer with a rotary blade.
CONSTITUTION: In a dicing system which cuts a wafer 2 into chips with a rotary blade 3, with the semiconductor wafer 2 placed and fixed on the chuck table 1 of the dicing device, an alignment unit 4 equipped with a CCD camera 4a is arranged in the vicinity of a chuck table 1, and this is connected to CPU5. And, the rotary blade 3 is made to fit the wafer 2 by performing the precutting before regular cutting, but the image of the curf on the wafer 2 is picked up with the CCD camera 4a by shifting the chuck table 1 to right below the alignment unit 4 after this precutting, and also it is processed with the curf parts as black and others as white, thus the chipping condition can be checked.
Inventors:
Kazuma Sekiya
Application Number:
JP14792392A
Publication Date:
July 09, 1997
Filing Date:
May 15, 1992
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; H01L21/78; (IPC1-7): H01L21/301
Domestic Patent References:
| JP3236260A |
Attorney, Agent or Firm:
Akimoto Teruo