Title:
AUTOMATIC DIE BONDING METHOD
Document Type and Number:
Japanese Patent JP3030400
Kind Code:
B2
Abstract:
PURPOSE: To provide an automatic die bonding method wherein the total treatment efficiency is improved by directly image-sensing a wafer magazine which loads wafers, by using a CCD camera.
CONSTITUTION: Many wafer carriers 16 wherein a wafer composed of set of dies is fixed on a carrier sheet are accommodated in a wafer magazine 11. The state that the wafer magazine 11 is mounted on a magazine elevator 12 is image-sensed by using a CCD camera 18, and position data of acceptable dies are obtained. The wafer carriers 16 are mounted on an XY stage 13 equipped with a die pick-up mechanism. In this state, only the acceptable die is carried on a lead frame, on the basis of the position data. Then die bonding is performed.
More Like This:
| JPH06177314 | SEMICONDUCTOR DEVICE |
| JPS5323284 | THYRISTOR |
Inventors:
Toshiya Matsubara
Hiroshi Shimazu
Hiroshi Shimazu
Application Number:
JP5283394A
Publication Date:
April 10, 2000
Filing Date:
February 24, 1994
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
H01L21/52; (IPC1-7): H01L21/52
Attorney, Agent or Firm:
Fujio Nakamae