Title:
AUTOMATIC POLISHING SYSTEM
Document Type and Number:
Japanese Patent JP2675222
Kind Code:
B2
Abstract:
PURPOSE: To provide a polishing system which can automatically polish a wafer one or more times efficiently.
CONSTITUTION: Polishing means 2, 4 and 6 are arranged roughly in a linear direction while being mutually spaced, a first robot 8 the operating area of the robot arm of which is overlapped with the plate resting sections 2a and 4a of the polishing means 2 and 4, and a second robot 22 the operating area of the robot arm of which is overlapped with the plate resting sections 4a and 6a of the polishing means 4 and 6, are arranged in the vicinity of the aforesaid polishing means. In addition, a carrier plate resting member 28 is disposed within the over-lapped area of the operating areas of the robot arm of the first robot 8 and the robot arm of the second robot 22.
Inventors:
Yukio Tsutsumi
Matsumoto Tatsumi
Keisuke Takahashi
Koji Koyama
Matsumoto Tatsumi
Keisuke Takahashi
Koji Koyama
Application Number:
JP691292A
Publication Date:
November 12, 1997
Filing Date:
January 17, 1992
Export Citation:
Assignee:
Mitsubishi Materials Corporation
Mitsubishi Materials Silicon Co., Ltd.
Mitsubishi Materials Silicon Co., Ltd.
International Classes:
B24B7/22; B23Q7/14; B23Q39/04; B24B27/00; B24B41/06; B25J18/04; H01L21/304; H01L21/677; H01L21/68; (IPC1-7): B24B41/06; B23Q7/14; H01L21/304; H01L21/68
Domestic Patent References:
| JP417979A | ||||
| JP61191847U |
Attorney, Agent or Firm:
Masatake Shiga (2 outside)
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