PURPOSE: To prevent the generation of an unsoldering state by arranging the rotary body driven by rotating at dipping time on the carrier for transferring printed circuit board.

CONSTITUTION: A discoid rotary body 14 is arranged on the carrier 12 transferring a printed circuit board and a projection 16 is set up at a specific pitch on the peripheral side part on the lower face of the rotary body 14 as well. The projection 17 having the same pitch as the projection 16 is provided at one side of the transfer chain 13. With this mechanism, the projection 17 of the chain 13 and the projection 16 of the rotary body 14 are engaged to rotate the rotary body 14 placing on a printed circuit board when the carrier 12 is transferred and passed through the above of a solder tank 4. A chip part is thus rotated at the time of solder dipping and the generation of an unsoldering state part by the gas caused at the back is prevented.