Title:
AUTOMATIC WAFER GRINDER
Document Type and Number:
Japanese Patent JPH07130691
Kind Code:
A
Abstract:
PURPOSE: To provide an automatic wafer grinder capable of unattended operation of grinding, polishing and cleaning wafers.
CONSTITUTION: A robot 1, surrounded by grinders 3 and 4, a polishing machine 5 and a cleaning device 6, carries wafers 2 under process. This arrangement makes unattended operation in production lines possible because of automated grinding, polishing and cleaning of wafers.
Inventors:
KATAYAMA HAJIME
Application Number:
JP27522293A
Publication Date:
May 19, 1995
Filing Date:
November 04, 1993
Export Citation:
Assignee:
KOMATSU MFG CO LTD
International Classes:
B24B41/06; B24B51/00; H01L21/304; (IPC1-7): H01L21/304; B24B41/06; B24B51/00; H01L21/304
Attorney, Agent or Firm:
Masaaki Yonehara (2 others)
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