To provide an automatic wafer chipping inspecting device capable of accurately inspecting the presence/absence of chipping at the peripheral part of a wafer in a short time.

This device is provided with a stage 12 for placing wafer 13 and plural image detecting units U11, U12,..., U44 arranged so as to cover all the periphery of the wafer 13 oppositely to the stage 12. Each of respective image detecting units Uij (i=1 to 4 and j=1 to 4) takes a region opposite to the detecting unit Uij inside the wafer 13 into the field of view and outputs a signal expressing an image in that region. A processing means 2 is provided for parallel discriminating the presence/absence of chipping in each region at a peripheral part 13p of the wafer on the basis of the image signal outputted by each of image detecting units Uij.