Title:
自動車レーダセンサアセンブリ
Document Type and Number:
Japanese Patent JP5426072
Kind Code:
B2
Abstract:
A radar electronics module includes a support structure having a first surface having a plurality of recesses with a transmitter circuit board and a receiver circuit board disposed thereon. The transmitter and receiver circuit boards are disposed over the first surface of the supports structure such that transmitter and receive circuits are disposed in cavities on the support structure. The radar electronics module further includes a digital/power supply circuit printed wiring board (PWB) disposed on a second surface of the support structure and a connector disposed on the support structure. The connector is disposed in such a way that it provides electrical connections for at least one of power signals, analog signals or digital signals between at least two of the digital/power supply PWB, the transmitter circuit board and the receiver circuit board.
Inventors:
Joseph S Preva
Richard Paul Donovan
Stephen Peel Blank
Richard Paul Donovan
Stephen Peel Blank
Application Number:
JP2006353598A
Publication Date:
February 26, 2014
Filing Date:
December 28, 2006
Export Citation:
Assignee:
Valeo Raytheon Systems, Inc.
International Classes:
G01S7/28; H01P5/107
Foreign References:
| WO1995025387A1 | ||||
| US6501415 |
Attorney, Agent or Firm:
Soichi Takezawa
Noritsugu Nakama
Noritsugu Nakama