To provide an on-vehicle semi-conductor audio instrument capable of enhancing the versatility of the design of an instrument panel by reducing the dimension in the distal direction of a design surface of the instrument panel.
In the on-vehicle semi-conductor audio instrument 10, a substantially flat collapsible lid 22 is turnably supported by a case part 16 fixed to a design surface 14 of an instrument panel 12, and a flat semi-conductor memory card 26 is installed on an upper surface of the collapsible lid 22 in an overlapping manner in the thickness direction. When the movable lid 22 is turned to the position parallel to the design surface 14, the semi-conductor memory card 26 is mounted on the on-vehicle semi-conductor audio instrument 10. In this mounting condition, a plate surface 26A of the semi-conductor memory card 26 is set to be parallel to the design surface 14.
COPYRIGHT: (C)2005,JPO&NCIPI
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Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda