Title:
BACK-FILLING METHOD OF DITCH
Document Type and Number:
Japanese Patent JP3454332
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve such problems that the carrying of fluidized treatment soil or slurry costs much and a fixing work of embedding materials in a ditch is separately required and a removing work of the fluidized treatment soil from construction members like sheet piles for retaining earth is required and further, a long waiting time is required and the working efficiency is poor because much time is consumed to place a large quantity of the fluidized treatment soil into the ditch.
SOLUTION: Water 2 and a solidifying agent 3 are added to a specified volume out of the excavated soil 1 resulting from the excavation of a ditch 11 to produce fluidized treatment soil 5 and a plurality of treated soil blocks 7 are made of the fluidized treatment soil 5 and preserved. When filling back the ditch 11, the soil blocks 7 are put in the ditch and the fluidized treatment soil 5 prepared for the placing is charged in the ditch.
Inventors:
Hikaru Goto
Atsushi Tanaka
Yasuo Ohara
Mutsumi Oshima
Atsushi Tanaka
Yasuo Ohara
Mutsumi Oshima
Application Number:
JP10274096A
Publication Date:
October 06, 2003
Filing Date:
April 24, 1996
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
Japan Telephone Facility Co., Ltd.
Japan Telephone Facility Co., Ltd.
International Classes:
E02D3/12; E02B9/06; E02F5/10; F16L1/038; (IPC1-7): E02B9/06; E02D3/12; E02F5/10; F16L1/038
Domestic Patent References:
| JP333583A | ||||
| JP639365A |
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)
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