Title:
バックノズルユニット、及びバックノズルユニットを含む基板処理装置
Document Type and Number:
Japanese Patent JP7419304
Kind Code:
B2
Abstract:
An apparatus for processing a substrate may include a processing module including at least one process chamber performing a desired process on a substrate and an index module transferring the substrate from an outside into the processing module. The at least one process chamber may include a supporting unit on which the substrate is placed and a back nozzle unit disposed under a bottom face of the substrate. The back nozzle unit may include a skirt, at least one back nozzle providing a cleaning solution onto the bottom face of the substrate and a gas nozzle providing a gas onto the bottom face of the substrate. The skirt may include a body and a plurality of first flow paths and a plurality of second flow paths which are formed in the body and provide a gas toward the bottom face of the substrate.
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Inventors:
Lim Jun Hyung
Jung Yun Seok
Song Gil Hung
Kanjungi
Jung Yun Seok
Song Gil Hung
Kanjungi
Application Number:
JP2021134728A
Publication Date:
January 22, 2024
Filing Date:
August 20, 2021
Export Citation:
Assignee:
SEMES CO., LTD.
International Classes:
H01L21/304
Domestic Patent References:
| JP2002177854A | ||||
| JP10135178A | ||||
| JP2003022997A | ||||
| JP2003126756A | ||||
| JP2018093146A | ||||
| JP11265868A |
Foreign References:
| US20170153550 |
Attorney, Agent or Firm:
Atsushi Honda