PURPOSE: To reduce in size by mounting in high density by forming so first and second conductive passages at pins as to transmit two different signals.

CONSTITUTION: A pin 2 passing through a board 1 is formed with an insulating layer 5 on an outer periphery of a rodlike metal material 6, a first conductive passage 3 on one surface of an upper layer of the layer 5, and with a second conductive passage 4 on the other surface to become an opposite surface of the passage 3. Then, a wiring material 14 is connected to the rear end 2B of the pin 2 to transmit a signal from the material 14 to the passage 3, and a pattern wiring 8 formed on the board 1 is connected to the passage 4 to transmit a signal from a pattern wiring 8 to the passage 4. Thus, two types of different signals can be transmitted by one pin, the quantity of pins to be arranged on the board can be reduced by half, and its size can be reduced by mounting in high density.