Title:
パターン化されたウエハの裏側急速加熱処理
Document Type and Number:
Japanese Patent JP5390094
Kind Code:
B2
Abstract:
Apparatus and methods of thermally treating a wafer or other substrate, such as rapid thermal processing (RTP) apparatus and methods are disclosed. An array of radiant lamps directs radiation to the back side of a wafer to heat the wafer. In one or more embodiments, the front side of the wafer on which the patterned integrated circuits are being formed faces a radiant reflector. In one or more embodiments, the wafer is thermally monitored for temperature and reflectivity from the side of the reflector.
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Inventors:
Ada Hold, Wolfgang
Llama Marcy, Thunder
Hunter, aeron
Llama Marcy, Thunder
Hunter, aeron
Application Number:
JP2007500864A
Publication Date:
January 15, 2014
Filing Date:
February 14, 2005
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/26; F26B19/00; F27B5/14; F27B17/00; F27D11/00; F27D19/00; F27D21/00; H01L21/00; H01L21/31
Domestic Patent References:
| JP2000234872A | ||||
| JP62030325A | ||||
| JP2002030443A |
Attorney, Agent or Firm:
Sonoda Yoshitaka
Kobayashi Yoshinori
Kobayashi Yoshinori