BACKFILL MATERIAL SET UNDER PRESSURE RECEIVING BOARD FOR STABILIZING SLOPE, BACKFILL METHOD USING BACKFILL MATERIAL, AND STRUCTURE FOR STABILIZING SLOPE

Title:

BACKFILL MATERIAL SET UNDER PRESSURE RECEIVING BOARD FOR STABILIZING SLOPE, BACKFILL METHOD USING BACKFILL MATERIAL, AND STRUCTURE FOR STABILIZING SLOPE

Document Type and Number:

Japanese Patent JP2001214449

Kind Code:

A

Abstract:

To provide a backfill material which is inserted between a slope and a pressure receiving board when the board is secured to the slope by pressing to stabilize the slope, increases bond between them, and contains an elastic absorbent where a hydraulic hardener such as cement milk permeates quickly.

A backfill material has a first room 2 that can impregnate and hold a hydraulic hardener and contain materials that can be compressed and deformed, and a second room 3 for supplying hydraulic hardeners that is adjacent to the first room 2. The first room is made from and surrounded by a permeable, flexible material with good ventilation. The first room is separated from the second room by a partitioning material 4 where a hydraulic hardener can pass easily.

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Inventors:

OOKA SHINKICHI
OKAZAKI MASAHIRO
CHO MITSUYOSHI

Application Number:

JP2000023466A

Publication Date:

August 07, 2001

Filing Date:

February 01, 2000

Export Citation:

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Assignee:

OOKA SHINKICHI
OKAZAKI MASAHIRO
CHO MITSUYOSHI

International Classes:

E02D17/20; (IPC1-7): E02D17/20

Domestic Patent References:

JPH07102569A	1995-04-18
JPH11280079A	1999-10-12
JPH0553894B2	1993-08-11

Attorney, Agent or Firm:

Sato Eto

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