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Title:
BACKING MATERIAL, ULTRASONIC PROBE, ULTRASONIC ENDOSCOPE, ULTRASONIC DIAGNOSTIC DEVICE, AND ULTRASONIC ENDOSCOPE DEVICE
Document Type and Number:
Japanese Patent JP2009060501
Kind Code:
A
Abstract:

To provide a backing material capable of suppressing increase of a surface temperature of an ultrasonic probe.

This backing material is arranged on a back surface of at least one oscillator for transmitting and/or receiving ultrasonic waves in an ultrasonic probe. The backing material is provided with: a backing base material containing a polymer material; and a heat-conducting fiber arranged in the backing base material, having heat conductivity larger than that of the backing base material, and continuously penetrating the backing material from its first surface contacting at least one oscillator to its second surface different from the first surface.


Inventors:
HIUGA HIROAKI
Application Number:
JP2007227641A
Publication Date:
March 19, 2009
Filing Date:
September 03, 2007
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
H04R17/00; A61B8/12
Domestic Patent References:
JP2006129965A2006-05-25
JP2006325954A2006-12-07
JP2006102135A2006-04-20
JP2005103078A2005-04-21
JPH10139893A1998-05-26
JP2007533106A2007-11-15
JP2003166178A2003-06-13
JP2000184497A2000-06-30
JP2007007262A2007-01-18
JP2006253958A2006-09-21
JP2002336258A2002-11-26
JP2005218519A2005-08-18
JPS6068832A1985-04-19
JP2004363746A2004-12-24
JP2007134767A2007-05-31
JP2006033801A2006-02-02
JP2007128986A2007-05-24
JPS6240495A1987-02-21
Attorney, Agent or Firm:
Masaaki Utsunomiya
Atsushi Watanabe