BACKING MATERIAL FOR ULTRASONIC PROBE AND MANUFACTURING METHOD THEREOF, AND ULTRASONIC PROBE

Title:

BACKING MATERIAL FOR ULTRASONIC PROBE AND MANUFACTURING METHOD THEREOF, AND ULTRASONIC PROBE

Document Type and Number:

Japanese Patent JP2022101148

Kind Code:

A

Abstract:

To provide a backing material having an improved attenuation rate of ultrasonic waves while maintaining thermal conductivity.SOLUTION: A backing material for an ultrasonic probe according to the present invention includes a carbonaceous matrix that has communication holes dispersed in the matrix, and a resin filled in the communication holes.SELECTED DRAWING: None

Inventors:

YAMADA KUNITAKA
ONO TOSHIKI

Application Number:

JP2020215569A

Publication Date:

July 06, 2022

Filing Date:

December 24, 2020

Export Citation:

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Assignee:

MITSUBISHI PENCIL CO

International Classes:

H04R17/00; A61B8/00; H04R31/00

Attorney, Agent or Firm:

Aoki Atsushi
Shinji Mihashi
Kentaro Ito
Yoshiki Kurata

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