Title:
バックライトアセンブリ
Document Type and Number:
Japanese Patent JP5568241
Kind Code:
B2
Abstract:
A backlight assembly includes a receiving container, a plurality of light-emitting modules, a driving unit and a side mold. The receiving container includes a bottom plate and a side part formed on a peripheral edge portion of the bottom plate. Light-emitting modules of the plurality of light-emitting modules are disposed in the receiving container. The light-emitting modules include a light-emitting base board and a plurality of light-emitting diodes ("LEDs") disposed on a first side of the light-emitting base board. The driving unit is disposed in the receiving container proximate to a lower portion of the peripheral edge portion of the bottom plate. The driving unit is electrically connected to the light-emitting modules to control an operation of the plurality of LEDs. The side mold is disposed on the lower portion of the peripheral edge portion of the bottom plate and covers the driving unit
Inventors:
Park Zhixi
Lee Yusui
Choi Sheng
Lee Yusui
Choi Sheng
Application Number:
JP2009028158A
Publication Date:
August 06, 2014
Filing Date:
February 10, 2009
Export Citation:
Assignee:
Samsung Display Co.,Ltd.
International Classes:
F21S2/00; F21K99/00; F21Y101/02
Domestic Patent References:
| JP2007305584A | ||||
| JP2007294385A | ||||
| JP2007172872A | ||||
| JP2006156325A |
Foreign References:
| WO2007037037A1 | ||||
| WO2005103560A1 |
Attorney, Agent or Firm:
Kyosei International Patent Office
Previous Patent: JPS5568240
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